We protect innovations in IC design, verification, and packaging. Practical patent strategies aligned with engineering roadmaps.
We prosecute patent applications across RTL, verification, interconnects, and packaging, and craft claims designed to maximize defensibility and business value. We connect architectural intent to measurable outcomes— latency, throughput, power, area, reliability—so claims resonate with engineering tradeoffs.
We advise on licensing strategies and international protection, including trade secret programs for sensitive design assets and methodologies. Our process covers IP blocks, coherency protocols, floorplanning, and package integration, pairing patents with defensive publications where appropriate.
Typical engagements include novel interconnect topologies, memory hierarchy innovations, accelerator offload strategies, and packaging solutions that impact thermals and signal integrity. We connect engineering tradeoffs to claim scope and use clear terminology that withstands scrutiny.
We set up invention harvesting programs attuned to design cycles: short disclosure prompts during architecture reviews, targeted sessions before tape‑out, and classification guidelines for patents vs. trade secrets.
We coordinate with design and verification teams to ensure disclosures are technically complete without exposing confidential PDK details or foundry‑specific data, keeping filings both strong and safe.